package

1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать

2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе

3) блок; узел; модуль; сборка

4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)

5) набор; комплект (напр. оборудования) || изготавливать или поставлять в виде набора или комплекта

6) (полностью) укомплектованное программное обеспечение (для розничной торговли); стандартное программное обеспечение

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- accounting package

- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead package
- beam-lead integrated circuit package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic-and-metal package

- ceramic dual in-line package

- ceramic-glass-metal package

- ceramic pin-grid array package

- ceramic quad flat package

- chaff package

- chip package

- chip scale package

- coaxial package

- command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt package
- deca-watt I-leads package
- double-prong package

- dual flat package

- dual flat package with flat leads

- dual in-line package

- FEB package
- flangeless package
- flange-sealed package
- flat package
- flat package G
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package

- heat-sink dual in-line package

- heat-sink quad flat package

- heat-sink single in-line package

- heat-sink small outline package

- heat-sink zigzag in-line package

- hermetic package

- high-energy leadless package
- high thermal plastic-ball grid array package
- inserted package
- integrated-circuit package
- integrated program package

- low-profile quad flat package

- metal electrode face bonded package

- micro ball-grid array package
- microcircuit package
- microepoxy package

- micro small outline package

- microwave package

- modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package

- plastic dual in-line package

- plastic quad flat package

- plastic small outline package

- plug-in package

- power flat package

- program package

- quad flat package

- quad flat package with flat leads

- quad flat package with J-leads

- quad in-line package

- radar package

- rectangular single in-line package

- self-contained package

- sensory package

- shrink dual in-line package

- shrink inserted package

- shrink single in-line package

- shrink small outline package

- shrink small outline large package

- shrink zigzag in-line package

- side-brazed package

- single-chip package

- single edge processor package

- single in-line package

- single-prong package
- skinny dual in-line package
- small outline package
- small outline J-leaded package
- small outline large package
- small outline transistor package
- small vertical package
- socket mounted package
- software package
- software compression-decompression package
- standard package
- standard inserted package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package

- surface horizontal package

- surface mount device package

- surface mount discrete package

- surface mounted package

- surface vertical package
- tape carrier package
- telemetering package

- thin quad flat package

- thin shrink outline L-leaded package

- thin small outline package

- thin small outline package I

- thin small outline package II

- TO package

- top-brazed package
- transistor-outline package

- ultra thin quad flat package

- ultra thin profile quad flat package

- very shrink pitch quad flat package

- windowed dual in-line package

- windowed small outline package

- zigzag in-line package